Senior Mechanical Design Engineer Resume

Title
Senior Mechanical Design Engineer

Primary Skills
Electronic Packaging, Electromechanical Design, Wireless Systems, Thermal Analysis, CFD, Computational Fluid Dynamics

Location
US-MN-Twin Cities (will consider relocating)

Posted
Nov-19-09

EDUCATION:
o BS Mechanical Engineering (BSME) - 1982, University of Wisconsin at Milwaukee. Milwaukee, Wisconsin. High Honors.(3.9 GPA). Named to Dean's List 8 times.

o MS Engineering Management -1987, Southern Methodist University.
Dallas,Texas. Concentration in concurrent engineering, operations research, project leadership and product development.

EXPERIENCE:

2006 to Senior Mechanical Design Engineer
Present Enclos, Corp.. Minneapolis, MN

o Lead mechanical design engineer for Enclos Corporation -- one of the largest private commercial design and construction companies in the U.S.

o Responsible for research and development of commercial curtain wall systems. Systems employ glass and structural support systems to provide stylish, energy efficient and structurally superior building enclosure. Emphasis placed on energy efficiency and architecturally attractive designs.

o Implemented finite element modeling software solutions that reduced thermal analysis times by over 70% increasing available time for research.

o Utilized Flovent computational fluid dynamics (CFD).software to study and enhance air flow in dual skin curtain wall assemblies for a major development in New York.

o Led the development of several major research projects intended to significantly reduce energy consumption and condensation risks through the use of nanoscale advanced materials .

o Strong skills in THERM and WINDOW finite element thermal analysis software for studying heat flow in complex window / curtain walls assemblies.


1999 to Senior Mechanical Design Engineer
2006 ADC, Inc. Minneapolis, MN

o Led the mechanical design and development of a new Street Coverage Solution (SCS) wireless digital distributed antenna system for personal wireless RF communication. Product features environmental hardening, passive natural convection thermal cooling and solar radiation reflective techniques. Significant skills in the use of Computational Fluid Dynamics (CFD) thermal analysis programs including Flotherm and CFDesign.

o Led the mechanical design development team for Digivance, a ground breaking 3G wireless digital indoor distributed antenna system capable of delivering seamless broadband services to cellular systems.

o Digivance product line projected to be a significant source of revenue for ADC in the expanding personal broadband wireless market.

o Received Key Contributor award for Digivance development efforts.

o Developed electronic packaging, thermal management and design for manufacturing (DFM) strategies for five major products within the Digivance line.

o Introduced product development strategies that resulted in enhanced communication and design for cost strategies between development team members. Strategies have been permanently adopted by ADC management. Strategies included Web based costing, target costing and real-time costing software.

o Led the mechanical design effort to reverse engineer outsourced, high cost, close tolerance RF tuning elements. Effort involved developing performance metrics, material research and plating techniques.
Developed processes for the application of clear chromate films and Fomblin (PTFE based) films to CDA 360 brass. Expected to generate annual savings of 1.2 million dollars.

o Special skills in rapid prototyping, reverse engineering, vendor research , process development and accelerated life testing.


1998 to Senior Mechanical Design Engineer
1999 Calix, Inc. (formerly Optical Solutions) Minneapolis, MN

o Lead mechanical design engineer responsible for developing the electro-mechanical system level design of an innovative telecommunications product capable of bringing fiber optics to the home. Company has been recognized in Telephony and Bandwidth Magazines.

o Developed reliability test programs to insure the long term performance of the product.

o Successfully developed original local powering and reserve power methods to permit on site AC hook-up .

o Redesigned to enhance field service and reliability a stand alone node permitting fiber near the home. Effort involved thermal testing and enhancements to reduce component junction temperatures.


1994 to Mechanical Design Engineer
1998 Turck, Inc. / InterlinkBT, Inc. Minneapolis, MN

o Lead mechanical design engineer responsible for developing high reliability industrial sensors and Multiplex factory automation systems. Product line has been awarded and recognized by Control Engineering International Magazine.

o First mechanical design engineer hired in the United States. Initiated Mechanical Design Department.

o Working knowledge of UL., CSA, DIN, NEMA, ANSI and IPC specifications.

o Led design program to identify, train and develop domestic sources of supply. Estimated annual savings for purchased parts of over $250K .

o Successfully brought to market over 130 unique network products.

o Strong skills in the industrial hardening/ protection of electronics and design of experiments.


1987 to Principal Hardware Development Engineer
1993 Alliant Techsystems, Inc. (formerly Honeywell) Minneapolis, MN

o Responsible for mechanical design, electronic packaging, process design and development, customer and vendor interface, cost estimating, structural analysis and testing for undersea systems.

o Provided cost, yield and cycle time improvements of production processes including machining and electromechanical assembly.

o Introduced quality improvement and cost reduction on a crucial aluminum investment cast chassis through frequent interface with customers, vendors, Manufacturing and Quality Assurance. Yearly cost saving on a critical program of $247 K.

o Special skills in design and use of engineering plastics, injection and insert molding, geometric dimensioning and tolerance (GDT) analysis, tooling, stainless steels, protective platings, aluminum, adhesives, fastening and joining techniques, cast and close tolerance machined parts.

1982 to Mechanical Design Engineer
1987 Texas Instruments, Dallas, Texas

o Responsible for mechanical design of electro-optical night vision systems.

o Design duties included optics and electronic packaging, conceptual packaging development, mechanism design, customer interface, cabling, material selection, shielding (EMI / RFI), human factors, thermal, structural and environmental testing.

o Working knowledge in the design and application of microsensors (MEMS).

o Led design team to develop a custom leadless ceramic 52 pin chip carrier (LCC) package for a CMOS device. Project required significant vendor interaction along with substantial reductions in scrub in , bonding and sealing clearances from previous conventions.

o Designed automated test equipment for the fabrication and testing of infra-red semiconductors. Equipment employed unique solution to gas and cryogenic fluid handling. Equipment was the first at Texas Instruments to test at wafer level.

o Was a member of the development team that developed the first “room temperature” infra-red detectors at Texas Instruments.

o Strong capabilities in the development of clean room manufacturing, design of experiments, statistical process control (SPC) and engineering standards.

o Special skills in design and application of surface mount electronics. Designed custom surface mount components and printed wiring assemblies including custom chip carriers and hybrids.

PERSONAL:
o Strong communication and interpersonal skills. A solid team leader.

o Skilled in interfacing with offshore suppliers ranging from Germany to Japan and China.

CAD / CAM SKILLS:
o Working knowledge of THERM, WINDOW, ProEngineer Wildfire, ProIntralink, Computational Fluid Dynamics (CFD) software Flotherm and CFDesign, AutoCad, Microsoft Project, Critical Path Scheduling, Design to Cost Software.

SOCIETY MEMBERSHIP:

ASHRAE -- American Society of Heating Refrigeration and Air-conditioning Engineers

ASM - American Society of Materials

IMAPS - International Microelectronic and Packaging Society


WEB LINKS:

www.enclos.com

Please see Our expertise / Computational Fluid Dynamics

www.adc.com

Please see Wireless Coverage:
http://www.adc.com/productsandservices/wirelesssolutions/products/outdoor/microbts.jsp

www.turck-usa.com
·
Many examples of products that I developed.

RECOGNITIONS:
o Tau Beta Pi and Phi Eta Sigma Engineering Scholastic Honor Societies.
o Sigma Epsilon Sigma Scholastic Honor Society.
o Received undergraduate degree with high honors (Summa Cum Laude).

Certifications
See above


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